機(jī)械英語(yǔ)詞匯翻譯-形狀與尺寸

線(xiàn)(通道)：conduction (track)
    導(dǎo)線(xiàn)(體)寬度：conductor width
    導(dǎo)線(xiàn)距離：conductor spacing
    導(dǎo)線(xiàn)層：conductor layer
    導(dǎo)線(xiàn)寬度/間距：conductor line/space
    第一導(dǎo)線(xiàn)層：conductor layer No.1
    圓形盤(pán)：round pad
    方形盤(pán)：square pad
    菱形盤(pán)：diamond pad
    長(zhǎng)方形焊盤(pán)：oblong pad
    子彈形盤(pán)：bullet pad
    淚滴盤(pán)：teardrop pad
    雪人盤(pán)：snowman pad
    V形盤(pán)：V-shaped pad
    環(huán)形盤(pán)：annular pad
    非圓形盤(pán)：non-circular pad
    隔離盤(pán)：isolation pad
    非功能連接盤(pán)：monfunctional pad
    偏置連接盤(pán)：offset land
    腹(背)*盤(pán)：back-bard land
    盤(pán)址：anchoring spaur
    連接盤(pán)圖形：land pattern
    連接盤(pán)網(wǎng)格陣列：land grid array
    孔環(huán)：annular ring
    元件孔：component hole
    安裝孔：mounting hole
    支撐孔：supported hole
    導(dǎo)通孔：via
    鍍通孔：plated through hole (PTH)
    余隙孔：access hole
    盲孔：blind via (hole)
    埋孔：buried via hole
    埋/盲孔：buried /blind via
    任意層內(nèi)部導(dǎo)通孔：any layer inner via hole (ALIVH)
    全部鉆孔：all drilled hole
    定位孔：toaling hole
    無(wú)連接盤(pán)孔：landless hole
    中間孔：interstitial hole
    無(wú)連接盤(pán)導(dǎo)通孔：landless via hole
    引導(dǎo)孔：pilot hole
    端接全隙孔：terminal clearomee hole
    準(zhǔn)表面間鍍覆孔：quasi-interfacing plated-through hole
    準(zhǔn)尺寸孔：dimensioned hole
    在連接盤(pán)中導(dǎo)通孔：via-in-pad
    孔位：hole location
    孔密度：hole density
    孔圖：hole pattern
    鉆孔圖：drill drawing
    裝配圖：assembly drawing
    印制板組裝圖：printed board assembly drawing
    參考基準(zhǔn)：datum referan